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TECHNICAL  DATA

 ITEM

SERIAL

 Rigid Board, RF

 Board Type

1

 FR4 -TG 155 °C (NY2150), ROGERS   (RO4003C)

 Material

2

 1-8 Layers Pcb Prototype (Don't Support Blind  /Buried Vias)

 Layers

3

 400mm *500mm

 Max Board Size

4

 0.50mm - 3.20mm

 Board Thickness

5

 0.15 mm

 Min line Width

6

 0.15 mm

 Min Space Width

7

 0.20 mm

 Min Hole Size

8

 0.15 mm

 Min Annular Ring

9

 0.15 mm

 Min Line Width (Legend )

10

 35 ، 52.5 ، 87.5 (um)

 Copper Thickness

11

 Green, Black, White, Blue, Red, Yellow

 Solder Mask Color

12

 White, Black, Yellow

 Silkscreen (Legend) Color

13

 HASL -Hot Air Solder Leveling

ENIG - Electro less Nickel / Immersion Gold

 Surface Finishing

14

 Yes

 Electrical Test

15

 Yes

 AOI (Automatic Optical Inspection) Test  

16

0.20، 0.25 ، 0.30 ، 0.36 ، 0.40 ، 0.50 ، 0.60 ، 0.70 ،0.80 ،1.00 ،1.20 ،1.60 (mm)

 Core Specification For Multilayer ،
 FR4 -TG 155 °C (NY2150) ،  Copper  Thickness = 18 um

17

106   RC72%  Thickness 50  um (2.00 mil±0.5) 
1080 RC63%  Thickness 70  um (2.80 mil±0.5)  
2313 RC58%  Thickness 100um (4.00 mil±0.5)   
2116 RC54%  Thickness 120um (4.70 mil±0.5)
1506 RC45%  Thickness 150um (5.90 mil±0.5)
7628 RC43%  Thickness 182um (7.20 mil±0.8)

 Prepreg Specification For Multilayer FR4- TG170°C (NY2170)

18