SERIAL

 ITEM

TECHNICAL  DATA

1 

Board Type

Rigid Board, RF

2

Material

FR4 standard TG 140 °C, ROGERS, TEFLON

3

Layers

1-8 Layers Pcb Prototype (Don't Support Blind /Buried Vias)

4

Max Board Size

400mm *500mm

5

Board Thickness

0.50mm - 3.20mm

6

Min line Width

0.20 mm

7

Min Space Width

0.10 mm

8

Min Hole Size

0.3 mm

9

Min Annular Ring

0.15mm

10

Copper Thickness

35um - 70um

11

Inner Layer Copper Thickness

18um ,35um

12

Solder Mask Color

Green, Black, White, Blue, Red, Yellow

13

Silkscreen (Legend) Color

White, Black, Yellow

14

Surface Finishing

HASL -Hot Air Solder Leveling

ENIG - Electro less Nickel / Immersion Gold

15

Electrical Test

Yes

16

AOI (Automatic Optical Inspection) Test  

Yes

17

Min Core Thickness For Multilayer

0.25 mm

18

 FR4 TG 140 °C  Prepreg  Specification For
Multi layer

106   RC 71.5% 57um

1080 RC 62%    76um

2113 RC 56%  100um

2116 RC 53%  130um

7628 RC 43%  200um