|
SERIAL
|
ITEM
|
TECHNICAL DATA
|
|
1
|
Board Type
|
Rigid Board, RF
|
|
2
|
Material
|
FR4 standard TG 140 °C, ROGERS, TEFLON
|
|
3
|
Layers
|
1-8 (layers)
|
|
4
|
Max Board Size
|
400mm *500mm
|
|
5
|
Board Thickness
|
0.50mm - 3.20mm
|
|
6
|
Min line Width
|
0.15mm
|
|
7
|
Min Space Width
|
0.15mm
|
|
8
|
Min Hole Size
|
0.2mm
|
|
9
|
Min Annular Ring
|
0.15mm
|
|
10
|
Copper Thickness
|
35um - 70um
|
|
11
|
Inner Layer Copper Thickness
|
18um ,35um
|
|
12
|
Solder Mask Color
|
Green, Black, White, Blue, Red, Yellow
|
|
13
|
Silkscreen (Legend) Color
|
White, Black, Yellow
|
|
14
|
Surface Finishing
|
HASL -Hot Air Solder Leveling
ENIG - Electro less Nickel / Immersion Gold
|
|
15
|
Electrical Test
|
Yes
|
|
16
|
AOI(Automatic Optical Inspection) Test
|
Yes
|
|
17
|
Min Core Thickness For Multilayer
|
0.15 mm
|
|
18
|
FR4 TG 140 °C Prepreg Specification For
Multi layer
|
106 RC 71.5% 57um
1080 RC 62% 76um
2113 RC 56% 100um
2116 RC 53% 130um
7628 RC 43% 200um
|