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TECHNICAL DATA
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ITEM
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SERIAL
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Rigid Board, RF
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Board Type
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1
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FR4 -TG 155 °C (NY2150), ROGERS (RO4003C)
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Material
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2
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1-8 Layers Pcb Prototype (Don't Support Blind /Buried Vias)
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Layers
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3
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400mm *500mm
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Max Board Size
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4
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0.50mm - 3.20mm
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Board Thickness
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5
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0.15 mm
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Min line Width
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6
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0.15 mm
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Min Space Width
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7
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0.20 mm
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Min Hole Size
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8
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0.15 mm
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Min Annular Ring
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9
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0.15 mm
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Min Line Width (Legend )
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10
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35 ، 52.5 ، 87.5 (um)
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Copper Thickness
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11
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Green, Black, White, Blue, Red, Yellow
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Solder Mask Color
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12
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White, Black, Yellow
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Silkscreen (Legend) Color
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13
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HASL -Hot Air Solder Leveling
ENIG - Electro less Nickel / Immersion Gold
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Surface Finishing
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14
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Yes
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Electrical Test
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15
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Yes
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AOI (Automatic Optical Inspection) Test
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16
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0.20، 0.25 ، 0.30 ، 0.36 ، 0.40 ، 0.50 ، 0.60 ، 0.70 ،0.80 ،1.00 ،1.20 ،1.60 (mm)
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Core Specification For Multilayer ،
FR4 -TG 155 °C (NY2150) ، Copper Thickness = 18 um
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17
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106 RC72% Thickness 50 um (2.00 mil±0.5)
1080 RC63% Thickness 70 um (2.80 mil±0.5)
2313 RC58% Thickness 100um (4.00 mil±0.5)
2116 RC54% Thickness 120um (4.70 mil±0.5)
1506 RC45% Thickness 150um (5.90 mil±0.5)
7628 RC43% Thickness 182um (7.20 mil±0.8)
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Prepreg Specification For Multilayer FR4- TG170°C (NY2170)
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18
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