TECHNICAL DATA
|
ITEM
|
SERIAL
|
Rigid Board, RF
|
Board Type
|
1
|
FR4 -TG 155 °C (NY2150), ROGERS (RO4003C)
|
Material
|
2
|
1-8 Layers Pcb Prototype (Don't Support Blind /Buried Vias)
|
Layers
|
3
|
400mm *500mm
|
Max Board Size
|
4
|
0.50mm - 3.20mm
|
Board Thickness
|
5
|
0.15 mm
|
Min line Width
|
6
|
0.15 mm
|
Min Space Width
|
7
|
0.20 mm
|
Min Hole Size
|
8
|
0.15 mm
|
Min Annular Ring
|
9
|
0.15 mm
|
Min Line Width (Legend )
|
10
|
35 ، 52.5 ، 87.5 (um)
|
Copper Thickness
|
11
|
Green, Black, White, Blue, Red, Yellow
|
Solder Mask Color
|
12
|
White, Black, Yellow
|
Silkscreen (Legend) Color
|
13
|
HASL -Hot Air Solder Leveling
ENIG - Electro less Nickel / Immersion Gold
|
Surface Finishing
|
14
|
Yes
|
Electrical Test
|
15
|
Yes
|
AOI (Automatic Optical Inspection) Test
|
16
|
0.20، 0.25 ، 0.30 ، 0.36 ، 0.40 ، 0.50 ، 0.60 ، 0.70 ،0.80 ،1.00 ،1.20 ،1.60 (mm)
|
Core Specification For Multilayer ،
FR4 -TG 155 °C (NY2150) ، Copper Thickness = 18 um
|
17
|
106 RC72% Thickness 50 um (2.00 mil±0.5)
1080 RC63% Thickness 70 um (2.80 mil±0.5)
2313 RC58% Thickness 100um (4.00 mil±0.5)
2116 RC54% Thickness 120um (4.70 mil±0.5)
1505 RC45% Thickness 150um (5.90 mil±0.5)
7628 RC43% Thickness 182um (7.20 mil±0.8)
|
Prepreg Specification For Multilayer FR4- TG170°C (NY2170)
|
18
|