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TECHNICAL DATA
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ITEM
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SERIAL
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Rigid Board, RF
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Board Type
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1
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FR4 -TG 155 °C (NY2150), ROGERS (RO4003C)
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Material
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2
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1-8 Layers Pcb Prototype (Don't Support Blind /Buried Vias)
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Layers
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3
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400mm *500mm
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Max Board Size
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4
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0.50mm - 3.20mm
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Board Thickness
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5
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0.15 mm
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Min line Width
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6
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0.10 mm
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Min Space Width
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7
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0.2 mm
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Min Hole Size
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8
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0.15mm
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Min Annular Ring
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9
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0.15 mm
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Min Line Width (Legend )
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10
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35um - 52.5um - 87.5um
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Copper Thickness
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11
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Green, Black, White, Blue, Red, Yellow
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Solder Mask Color
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12
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White, Black, Yellow
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Silkscreen (Legend) Color
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13
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HASL -Hot Air Solder Leveling
ENIG - Electro less Nickel / Immersion Gold
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Surface Finishing
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14
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Yes
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Electrical Test
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15
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Yes
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AOI (Automatic Optical Inspection) Test
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16
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0.20mm ، 0.25mm ، 0.30mm ، 0.36mm ،
0.40mm ، 0.50mm 0.60mm ، 0.70mm ، 0.80mm ، 1.00mm ، 1.20mm ، 1.60mm
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Core Specification For Multilayer ،
FR4 -TG 155 °C (NY2150) ، Copper Thickness = 18 um
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17
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106 RC72%-Thickness 50um (2.00±0.5mil)
1080 RC63% -Thickness 70um (2.80±0.5mil)
2313 RC58% -Thickness 100um(4.05±0.5mil)
2116 RC57% -Thickness 130um (5.15±0.5mil)
7628 RC52%-Thickness 220um (8.90±0.8mil)
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Prepreg Specification For Multilayer FR4- TG155°C (NY2150)
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18
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